Huawei Technologies will launch two new artificial-intelligence semiconductors in 2027, rotating chairman David Wang said on Thursday, as the tech giant builds up its AI computing business and seeks to challenge US chipmaker Nvidia. Huawei plans to launch the 960DT in the first quarter and the Ascend 960PR in the third quarter, he said. The company is also working on ways to connect very large numbers of AI chips, allowing them to work together as one bigger computing system. Most advanced AI programmes ⁠require more processing power than a single chip can provide. Wang said in a speech ⁠at a company event in ⁠Shanghai that Huawei's UnifiedBus technology would be a key link in the company's next generation of large AI systems. The technology is intended to help chips share information and work together ⁠more efficiently. Huawei has developed 11 semiconductors based on UnifiedBus technology for use in its large systems, he said. Its largest linked systems, which the company calls superclusters, can support up to one million AI processors, he added. Huawei has shipped more than 1,000 smaller linked systems, called supernodes, to more than 370 customers, Wang said. A supernode ⁠is a system that brings together many AI chips to tackle the same task. He did not say how many chips could be connected within a single supernode, name customers, or give a breakdown of shipments. Washington has imposed export controls that restrict China's access to certain advanced computing chips and semiconductor manufacturing equipment, while Chinese companies and policymakers have placed greater emphasis on building domestic alternatives. (Reuters) Edited by Aaron Tam